本論文提出結合網路分析儀以及用於電磁耐受標準測試之大電流注入探棒等設備發展的共模電流轉換係數量測方法，用來預測印刷電路板產生之電磁輻射干擾。一般而言，印刷電路板產生的電磁輻射干擾是相當複雜且難以被偵測或加以改善，本論文提出的共模電流轉換係數量測方法可用來偵測薄膜電晶體液晶顯示器驅動電路板內直流電源迴路所產生的電磁輻射干擾，預測結果能吻合全電波暗室遠場之量測結果。所提出的量測方法也能準確地預估加入改善對策後電磁輻射干擾的改善量。此外，電磁模擬及等效電路模型化方法也被成功地用來驗證所偵測電磁輻射干擾的準確性。隨著目前射頻電路的操作頻率已達GHz頻段，印刷電路板上的微帶元件產生的電磁輻射干擾已不容忽視，本論文所提出的方法也能夠用來量測微帶元件的共模電流轉換係數，以偵測微帶元件所產生之電磁輻射干擾，並且也能與全電波暗室遠場量測結果有良好之符合度。此方法也成功預估藉由縮小微帶濾波器元件尺寸所獲得之電磁輻射干擾改善量，並且經由電磁模擬加以驗證。

This dissertation proposes a novel measurement method using a network analyzer with a bulk current injection (BCI) probe that is used in standard electromagnetic susceptibility (EMS) test to estimate the far-field radiated emissions from printed circuit board (PCB). Generally speaking, radiated emission from PCBs is very complex and difficult to resolve. The proposed method is used to predict the common-mode radiated emission caused by the DC supply loops on a driver PCB of thin film transistor-liquid crystal display (TFT-LCD) panel, which highly correlates with the radiated emission measurements obtained for the TFT-LCD panel in a fully anechoic chamber (FAC). The proposed technique is also successful to estimate the reduction of a specific peak in the radiated emission spectrum by shielding the DC supply loops. Electromagnetic simulation and equivalent-circuit modeling approaches are developed to confirm the common-mode radiation mechanism in this study. As the operating frequency has reached the gigahertz range for an RF PCB, the on-PCB microstrip components radiate more efficiently than ever at low frequencies. The proposed method can also be to measure the common-mode current conversion coefficient of microstrip components in an RF PCB. Based on the proposed measurement method, far-field radiated emissions from microstrip components are obtained, which closely corresponds to measurements in a FAC. The proposed method also estimates the radiated emission reduction by miniaturizing the physical size of microstrip bandpass filters (BPFs). Full-wave electromagnetic simulation further demonstrates the effectiveness of the measurement method.

1 Introduction 1
1.1 Research Motivation 1
1.2 Measurement Method for PCB Radiated Emissions 2
1.2.1 Far-Field Radiated Emission Measurement 2
1.2.2 Near-Field Scanning Techniques 3
1.2.3 Common-Mode Current Measurement 4
1.3 Bulk Current Injection (BCI) Immunity Test 5
1.4 Dissertation Overview 6
2 Calibration and Modeling of BCI Probe 8
2.1 Calibration of BCI probe 8
2.2 Modeling of BCI probe 13
3 Estimating the Variation in Radiated Emission from TFT-LCD Panel 17
3.1 Diagnosis of Common-Mode Radiation from TFT-LCD Panel 17
3.1.1 Radiated Emission Problem in a TFT-LCD Panel 17
3.1.2 Common-Mode Currents on a DC Supply Loop 21
3.1.3 Radiated Emission from a Driver PCB 27
3.2 Improvement and Assessment Methods 29
4 Estimating the Variation in Radiated Emission from Microstrip Components 34
4.1 Radiated Emission from Microstrip Line 34
4.2 Radiated Emission from Microstrip Bandpass Filter 39
4.3 Reduction of Radiated Emission from Miniaturized Microstrip Bandpass Filter 45
4.3.1 Reduction of Common-Mode Current Conversion Coefficient 45
4.3.2 Reduction of Radiated Emissions 49
5 Conclusions 51
Bibliography 53
Vita 60

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