現今許多無線通訊的應用已將元件操作頻率推升至毫米波段，因此對封裝結構的選用更是關鍵。本論文致力於研究低成本寬頻四方扁平無接腳封裝結構，以能實現晶片、封裝和基板至毫米波段的共模擬。基於上述思維，本論文提出兩種方法。首先，藉由砷化鎵的背穿孔以及鎊線連接來形成兩接地路徑並聯，為了比較特性，將圓形鎊線及帶狀鎊線分別實現在有塑膠灌模之四方扁平無接腳封裝。同時，為了得到精確的鎊線電性特性，去嵌化的流程也被建立。其次，將缺陷接地結構應用於四方扁平無接腳封裝，此乃是文獻中首度提出利用缺陷接地結構本身的電感性來補償封裝轉接介面先天上之電容性。除此之外，本論文在共設計上亦考慮了用來保護晶片之塑膠灌模效應。值得一提的是，此缺陷接地結構是在四方扁平無接腳封裝外部實現，因此不用修改封裝原先的設計。所以，此技術可以廣泛地應用於其他四方扁平無接腳封裝或擁有相似接腳的鎊線封裝上。最後，此缺陷接地結構的開口有助於阻抗匹配並能降低植入損耗，因而提升了操作頻率的範圍到達E頻帶。藉由小心的設計，本論文的模擬結果與量測結果皆具有良好的吻合度。

Nowadays many wireless communication applications have pushed device operation frequency into millimeter-wave range. For this reason, the selection of a package is critical. The dissertation aims to investigate a low-cost wideband QFN package for realizing chip-package-board co-simulation up to millimeter-wave frequencies. The dissertation addresses two approaches for this purpose. Firstly, the QFN package uses two ground paths in parallel with the help of backside via of GaAs chip and wire-bonding connection. The performance comparison is made between round bond-wires and ribbon bond-wires for the package with a plastic molding. To obtain the accuracy performance of wire-bonding transition, a de-embedding process is established. Secondly, a defected ground structure (DGS) is studied for application to the QFN package. The technique of using high-impedance DGS with an inductive characteristic was presented for the first time to compensate for the packaging transition that has a capacitive nature. Moreover, the chip-package co-design considers the effects of the necessary plastic molding for chip protection. It is worth to mention that the DGS was implemented externally to the QFN package, so there is no need to alter the design of the QFN package. The proposed technique can thus be widely applied to many other QFN packages or wirebond packages with similar lead configurations. Finally, the DGS opening helps to improve impedance matching and reduces the insertion loss, thus further extending the range of operating frequencies to E band. Through the careful design, the simulation results agree with measurement results quite well in this dissertation.

1 Introduction 1
1.1 Research Motivation 1
1.2 Millimeter Wave Applications and Packaging-related Challenges 2
1.3 Chip-to-Package Structures at Millimeter-Wave Frequencies 5
1.3.1 Millimeter-wave Interconnect Technologies 5
1.3.2 Millimeter-wave Leadless Package Structures 8
1.4 Objectives and Organization of Dissertation 10
2 Performance Improvement for Chip-Package-Board Co-Design 12
2.1 Introduction 12
2.2 Package Structure Selection 14
2.3 Two Ground Paths in parallel Technique 16
2.3.1 Improving Current Return Paths in Package Structure 16
2.3.2 Characteristics of Round and Ribbon Bond-wires 21
2.3.3 Performance Comparison of Various Wirebond Transitions 26
2.3.4 Simulation and Experimental Results 28
2.4 On Chip and PCB Board De-Embedding Processes 30
2.4.1 Through-Line-Line (TLL) Calibration 32
2.5 Summary 33
3 Defected Ground Structure (DGS) Design for Bandwidth Extension 35
3.1 Introduction 35
3.2 Analysis and Design DGS 36
3.2.1 Characteristics of the Defected Ground Transmission Line 36
3.3 Chip-Package-Board Co-Design 40
3.3.1 Effects of Wideband DGS on QFN package structure 40
3.4 Co-Simulated and Measured Results 46
3.5 Summary 50
4 Conclusions 51
Bibliography 53
Vita 61

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