本研究目的是研製應用於W-CDMA系統發射機之兩個關鍵性元件正交調制器與升頻器GaAs HBT MMICs，而且完整包含封裝及電路板效應之評估。嚴謹地探討HBT小訊號模型與封裝及電路板互連效應之電磁特性化以建立完整的分析理論。本論文提出一種與外部電感無關的新萃取方法可以直接萃取HBT混成pi等效電路之內部元件。使用三維電磁模擬軟體計算無腳式射頻封裝與功能測試用電路板之互連效應並且將之以等效電路表示，進而與設計的HBT MMICs整合分析。第一個HBT MMIC設計是採用新型90度相移器之W-CDMA直接升頻正交調制器。與目前文獻報告之90度相移器比較，本論文所提出之新型90度相移器在實現損耗的特性上具有相當的優勢，然而此90度相移器容易受封裝及電路板效應的影響導致EVM某種程度的惡化。第二個HBT MMIC設計是採用微混波器之W-CDMA升頻器。與採用Gilbert混波器設計之升頻器比較，採用微混波器設計之升頻器在低功率輸出的情況下消耗比較小的電流即可達到相同的高線性度，然而此升頻器容易受封裝及電路板效應的影響導致ACPR嚴重的惡化。比較理論與量測結果驗證封裝及電路板效應對兩個HBT MMICs的影響評估。

This research aims to design and implement GaAs HBT MMICs for the two crucial components in W-CDMA transmitters, quadrature modulator and upconverter, with thorough evaluation of the package and PCB effects. To construct a strong theoretical foundation, the small-signal modeling of HBTs and the EM-characterization of package and PCB interconnects are intensively studied. In this dissertation, a novel extrinsic-inductance independent approach is developed for direct extraction of the intrinsic elements in a hybrid-pi equivalent circuit of HBTs. The interconnects of leadless RFIC packages and test PCBs are investigated using the 3-D EM simulation tools and transformed into the equivalent circuits for co-analysis with the designed HBT MMICs. The first HBT MMIC design is a W-CDMA direct-conversion quadrature modulator incorporating a new 90 degrees phase shifter. Although the proposed 90 degrees phase shifter has a remarkable advantage over the others in implementation loss, it is rather susceptible to the package and PCB effects, resulting in a moderate degradation of EVM. The second HBT MMIC design is a W-CDMA upconverter incorporating a popular micromixer. Although the micromixer-based upconverter consumes much less current at low output powers to achieve the same high linearity when compared to a Gilbert mixer-based design, it is quite susceptible to the package and PCB effects, causing a significant degradation in ACPR. Comparison between theory and measurement shows good agreement in evaluating the influences of package and PCB interconnects on both HBT MMICs.

1 Introduction 1
1.1 Research Motivation 1
1.2 Heterojunction Bipolar Transistor 2
1.2.1 Device Physics and Gummel-Poon Model 2
1.2.2 Parameter Extraction Approaches of Gummel-Poon Model 7
1.3 W-CDMA MMIC Designs 9
1.3.1 Quadrature Modulator 9
1.3.2 Upconverter 10
1.4 Package and PCB Effects on MMICs 12
1.5 Volterra Series and the Applications to MMIC Designs 13
1.6 Overview of Dissertation 13
2 Extraction of HBT’s Small-Signal Equivalent-Circuit Parameters 16
2.1 Extraction of Intrinsic Elements 16
2.2 Extraction of Extrinsic Elements 26
3 Design of Quadrature Modulator MMIC with Evaluation of Package and PCB Effects 31
3.1 Quadrature Modulator MMIC Featured with a New 90o Phase Shifter 31
3.2 Evaluation of Package and PCB Effects on the Implemented Quadrature Modulator 38
3.2.1 90o Phase Shifter 40
3.2.2 Double-Balanced Mixer 41
3.2.3 Differential to Single-Ended Converter 43
3.2.4 Output Buffer 44
3.2.5 Overall Effects 45

3.3 Results and Discussions 46
3.3.1 EVM 46
3.3.2 Sideband Suppression 47
4 Design of Upconverter MMIC with Evaluation of Package and PCB Effects 50
4.1 Intermodulation Distortion Analysis 50
4.1.1 Micromixer 52
4.1.2 Active Balun 57
4.2 Chip Implementation and Parasitic Extraction of Package and PCB Interconnects 60
4.3 Cascade Intercept Point and ACPR Estimation 63
4.4 Comparison of Results and Discussions 66
5 Conclusions 72
Bibliography 74
Appendix 82
Vita 85

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