本論文針對在有機基板上的貫穿孔結構，探討其高頻特性以及不同結構尺寸對電性特性的影響。論文內容主要分為四部份，第一部分主要介紹在基板上各種連通柱的種類，包含基板鑽孔的製作流程與現有的鑽孔能力，且針對貫穿孔的結構與製程上的考量做進一步的探討。第二部分為實際的貫穿孔量測，介紹高頻雙面量測技術，以及比較傳統高頻共面探針量測與雙面量測的差異。第三部分為利用Ansoft HFSS全波模擬軟體進行高頻模擬分析，同時探討軟體中不同激發源的設定以及模型結構對模擬結果的影響。第四部份為依據其物理結構建立寬頻的等校電路模型，探討不同尺寸結構的貫穿孔在電性特性上的差異以及提出相關的設計概念。

This thesis focuses on the structures of plated through holes in organic substrate, and discusses the high-frequency electrical characteristics of various plated through hole structures. This thesis consists of four parts. The first part introduces various kinds of vias in multilayer substrate. This content includes substrate drilling processes and capabilities, and discussions on plated through hole structures and their manufacture concerns. The second part focuses on actual measurement of plated through holes, and introduces high-frequency double-side probing technique. The difference from traditional high-frequency coplanar probing measurement is also discussed. The third part focuses on the high-frequency simulation by full-wave software – Ansoft HFSS, and discusses the effects of various excited source and model structures on simulations. Part4 focuses on developing the broadband equivalent circuit model based on the physical structures, and discusses the electrical characterization of different plated through holes, and provides the related design concept.

第一章 緒論 1
1.1 研究動機 1
1.2 先前技術簡介 2
1.3 章節介紹 4
第二章 基板之連通柱製程與結構 5
2.1 基板結構與連通柱種類 5
2.2 連通柱結構與製程考量 7
2.3 有機基板貫穿孔尺寸探討 12
第三章 有機基板貫穿孔之量測 15
3.1 雙面量測技術 15
3.2 單埠量測結果 18
3.3 雙埠量測結果 28
第四章 有機基板貫穿孔之全波模擬分析 31
4.1 HFSS電磁模擬技術 31
4.2 Lump port激發之結果 31
4.3 Wave port激發之結果 41
4.4 基板尺寸之影響 45
4.5 討論與建議 50
第五章 模型化分析與特性探討 52
5.1 寬頻模型萃取技術 52
5.2 寬頻模型化結果 54
5.3 不同尺寸之貫穿孔特性 60
第六章 結論 65
參考文獻 66
附錄一 自然諧振頻率點列表（50MHz ~ 40GHz）i
附錄二 自然諧振頻率點列表（40GHz ~ 50GHz）ii
附錄三 模擬設定與模擬時間列表 iii

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