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論文名稱 Title |
在含內埋式電感與電容元件之LTCC 多層基板上實現2.4 GHz 雙點電壓控制振盪器
Design and Implementation of 2.4 GHz Two-Point Voltage-Controlled Oscillators on a Multilayer LTCC Substrate with Embedded Inductors and Capacitors |
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系所名稱 Department |
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畢業學年期 Year, semester |
語文別 Language |
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學位類別 Degree |
頁數 Number of pages |
72 |
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研究生 Author |
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指導教授 Advisor |
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召集委員 Convenor |
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口試委員 Advisory Committee |
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口試日期 Date of Exam |
2003-07-01 |
繳交日期 Date of Submission |
2003-07-24 |
關鍵字 Keywords |
雙點電壓控制振盪器、相位雜訊、低溫共燒陶瓷 Two-Point Voltage-Controlled Oscillator, Low-Temperature Cofired Ceramic Technology, Phase Noise |
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統計 Statistics |
本論文已被瀏覽 5753 次,被下載 5046 次 The thesis/dissertation has been browsed 5753 times, has been downloaded 5046 times. |
中文摘要 |
本論文第一部分完成了應用在開迴路與雙點閉迴路調制藍芽發射機之雙點壓控振盪器,包含了Hybrid 電路模組與CMOS RFIC 兩種設計。第二部分則設計了六個LTCC 內埋式電感與電容元件,經由傳統之p 模型等效電路,所萃取出之結果皆能與模擬相符,並且模型之頻率響應可準確至自我諧振頻率點附近。最後,則利用之前所設計之CMOS 雙點壓控振盪器晶片與LTCC 內埋式元件,實現出LTCC 雙點壓控振盪器模組,並有效的縮小電路模組面積。 |
Abstract |
In the first, we design and implement a Two -Point Voltage-Controlled Oscillator which applied in Open-Loop and Two-Point Close-Loop Modulation Bluetooth transmitter and include Hybrid and CMOS RFIC design. Second, we design six LTCC embedded components including inductors and capacitors. The extraction result via traditional equivalent πmodel match the simulation and the frequency response of adopted model can accurate to device’s Self-Resonant-Frequency nearby compare with measurement. In the end, we design and implement a LTCC Two-Point Voltage-Controlled Oscillator module and effective ly reduce the module size. |
目次 Table of Contents |
目錄 I 圖表目錄 II 第一章 緒論 1 第二章 雙點電壓控制振盪器設計 3 2.1 簡介 3 2.2 雙點電壓控制振盪器Hybrid電路模組設計 5 2.2.1 振盪器之原理與分析 5 2.2.2 設計與製作 8 2.2.3 量測與模擬結果 9 2.3 CMOS雙點電壓控制振盪器 14 2.3.1 研究現況與原理 14 2.3.2 設計與製作 21 2.3.3 模擬結果 23 2.3.4 量測結果與討論 25 第三章 低溫共燒陶瓷內埋式電感與電容元件設計 32 3.1 簡介 32 3.2 研究現況 32 3.3 設計原理與方法 35 3.4 模擬與量測結果 38 3.4.1 2.2nH 串聯電感器設計 38 3.4.2 10nH 串聯電感器設計 42 3.4.3 1pF 串聯電容器設計 45 3.4.4 20pF 串聯電容器設計 49 3.4.5 2pF 接地電容器設計 53 3.4.6 10pF 接地電容器設計 56 3.5 討論 59 第四章 LTCC雙點電壓控制振盪器 62 4.1 簡介 62 4.2 LTCC模組之實現 62 4.2.1 模擬與量測結果 63 4.2.2 討論 65 4.3 LTCC模組版本與PCB 模組版本之比較 66 第五章 結論 68 參考文獻 69 |
參考文獻 References |
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